Scratch/dig specifications define the allowable surface defects on semiconductor wafers and optical substrates. Researchers often require specific scratch/dig values when ordering fused silica wafers, silicon wafers, sapphire, quartz, and other materials used in photonics, MEMS, laser systems, and semiconductor devices. UniversityWafer, Inc. supplies polished substrates with custom scratch/dig requirements, thickness tolerances, and surface finishes for research and production applications.
Researchers often need polished wafers with controlled scratch/dig specifications for optical, semiconductor, MEMS, and photonics applications. Scratch/dig requirements help define the allowable surface defects on substrates such as fused silica wafers, quartz, sapphire, and silicon wafers.
A corporate researcher requested help with the following fused silica wafer specification:
“Do you have fused quartz wafers? I am interested in availability, cost, and lead time for 100mm fused silica wafers at 500 ± 25µm thickness, polished on both sides.
I would also like to know the thickness tolerance, surface smoothness, and whether the wafer has a flat like a typical silicon wafer. Specifically, we need substrates with a 60/40 scratch-dig surface quality according to MIL-PRF-13830 style optical inspection requirements.”
Reference #95768 for specs and pricing.
UniversityWafer, Inc. can help quote custom optical substrates, polished wafers, fused silica, quartz, sapphire, and silicon materials with the scratch/dig specification required for your research.
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In semiconductor wafers and optical substrates, scratch/dig specifications define the maximum allowable surface defects on polished materials. These standards are commonly applied to silicon wafers, fused silica, sapphire, quartz, and other optical substrates used in photonics, MEMS, sensors, and semiconductor devices.
Surface quality directly affects device yield, optical transmission, thin film deposition, and overall substrate reliability. Lower scratch/dig values correspond to smoother surfaces and fewer defects.
A scratch is a linear surface defect caused by polishing, cleaning, or handling. A dig is a small pit or indentation created by particles or imperfections during manufacturing.
| Scratch/Dig | Typical Use |
|---|---|
| 60/40 | General optical and semiconductor applications |
| 40/20 | High-quality polished substrates |
| 20/10 | Precision optics and laser systems |
| 10/5 | Premium semiconductor and photonics applications |
Surface defects can affect device performance, optical clarity, and manufacturing yield. Tight scratch/dig requirements are especially important for:
Different applications require different surface quality levels. Advanced semiconductor devices and optical systems generally require low scratch/dig values to minimize scattering and maximize performance.
Scratch/dig requirements are commonly specified according to industry standards including: