A semiconductor engineer requested a quote for the following.
I am looking for optical transmission of the Ge wafers in 4 um-12um range. I would really appreciate if you could e-mail me the part nos and optical transmission of your Ge wafers (undoped, n-type and p-type). Also, the transmission with AR coating if you have any data.
I would appreciate if you include other electro-optical characteristics too, but the main parameter is the transmission.
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A lead semiconductor engineer requested a quote for the following.
We are loooking for 2 boxes ( ~ 50 wafers) of 4 inch ( 100 mm diameter) of 4H-SiC ( i.e silicon carbide) dummy grade mechanical substrates with 2 standard SEMI flats. Can you please give us a quotation.
Reference #301679 for specs and pricing.
Advanced Semiconductor Engineering (ASE) refers to sophisticated, high-tech processes involved in semiconductor manufacturing, particularly in IC packaging, assembly, and testing. ASE is also the name of one of the world's largest providers of outsourced semiconductor assembly and test (OSAT) services.
Advanced semiconductor engineering encompasses cutting-edge techniques and technologies including:
Advanced IC Packaging:
Innovative Assembly and Integration:
High-Level Testing and Reliability Assurance:
Advanced Semiconductor Engineering, Inc. (ASE Group) is a global leader headquartered in Taiwan. It specializes in offering integrated solutions for semiconductor assembly, testing, and packaging, supporting industry giants and enabling innovation in sectors like automotive, communications, computing, healthcare, and IoT.
In short, advanced semiconductor engineering involves highly specialized techniques essential to meeting modern demands for miniaturization, higher performance, power efficiency, and reliability in electronic devices.
Semiconductor engineering is a specialized branch of engineering dedicated to the design, development, manufacturing, testing, and optimization of semiconductor devices and systems. Semiconductors—primarily silicon-based—form the critical foundation of nearly all modern electronic devices, from smartphones and computers to automobiles, medical devices, sensors, and even spacecraft.
Device Physics and Materials Science:
gallium nitride, etc.).Wafer Fabrication (Front-end Process):
Device Design and Modeling:
Integrated Circuit (IC) Design:
Packaging and Assembly (Back-end Process):
Testing and Characterization:
Yield Enhancement and Process Optimization:
Equipment Engineering:
Semiconductor engineering plays a critical role in enabling technological advancement and innovation. Key future trends include:
In essence, semiconductor engineering is a multidisciplinary, dynamic, and foundational field that directly enables virtually all of modern technology.
The most common job titles associated with semiconductor engineering can vary depending on the specific focus area, seniority level, and company structure. Here’s a comprehensive overview categorized by roles:
These roles can differ slightly based on the company’s size, specialization, or whether it’s involved in fabrication, design, research, or manufacturing support. Semiconductor companies typically structure teams according to specialized processes and stages, leading to diverse opportunities within the industry.
Duties: Design, simulate, and optimize semiconductor devices (transistors, diodes, sensors); perform electrical characterization; analyze device physics; troubleshoot and resolve fabrication issues. Skills: Semiconductor physics, TCAD simulation tools, electrical characterization, data analysis, problem-solving.
Duties: Develop integrated circuit layouts, schematics, and specifications; conduct simulations and verification of IC designs; optimize chip performance, power consumption, and reliability. Skills: IC design software (Cadence, Synopsys, Mentor Graphics), CMOS design techniques, circuit simulation, strong analytical skills, attention to detail.
Duties: Design analog and mixed-signal circuits (amplifiers, ADC/DAC, PLLs); model and simulate analog performance; test prototypes and validate designs. Skills: Analog electronics, mixed-signal design principles, circuit simulation tools, lab equipment proficiency, precision and accuracy in design.
Duties: Develop digital circuits and logic designs; create RTL code (Verilog/VHDL); simulate and verify digital functionality; support physical implementation and timing closure. Skills: Digital logic design, Verilog/VHDL coding, FPGA/ASIC experience, logic simulation tools, problem-solving.
Duties: Develop Application-Specific Integrated Circuits; perform RTL coding, synthesis, layout support, verification, and validation; ensure design meets performance and manufacturing requirements. Skills: RTL coding (Verilog/VHDL), ASIC design flow, synthesis and timing analysis tools, excellent debugging skills, detail-oriented mindset.
Duties: Design and develop RF/microwave semiconductor components and circuits; perform electromagnetic simulations; test and characterize RF performance; optimize RF designs for production. Skills: RF design principles, microwave simulation software (ADS, HFSS), hands-on test equipment experience, EM theory knowledge, excellent analytical ability.
Duties: Develop Micro-Electro-Mechanical Systems; perform MEMS device design, fabrication, and characterization; run mechanical/electrical simulations; resolve MEMS integration challenges. Skills: MEMS device physics, fabrication processes, finite-element analysis (COMSOL/ANSYS), cleanroom techniques, creativity, and problem-solving.
Duties: Integrate and optimize semiconductor fabrication processes; improve device yields and reliability; coordinate with process engineers to troubleshoot fabrication issues. Skills: Semiconductor processing knowledge, integration skills, data analysis, strong communication, analytical troubleshooting.
Duties: Develop and optimize lithography processes; maintain photoresist coating, exposure, and development; ensure high resolution and yield; resolve process defects. Skills: Photolithography techniques, optics, familiarity with lithography equipment, analytical mindset, problem-solving skills.
Duties: Develop and optimize diffusion and doping processes; manage furnace operations; analyze doping profiles; ensure accurate dopant distribution. Skills: Diffusion physics, furnace operations, SIMS measurement techniques, process control, detail-oriented analytical skills.
Duties: Manage thin-film deposition processes (CVD, ALD, sputtering); maintain equipment, monitor deposition uniformity, troubleshoot quality issues. Skills: Deposition techniques, vacuum systems knowledge, characterization tools (XRD, SEM), methodical troubleshooting skills.
Duties: Optimize dry and wet etching processes; maintain plasma etch equipment; analyze etch rate and profiles; solve etching-related yield issues. Skills: Etching chemistry, plasma physics, equipment maintenance, problem-solving, attention to detail.
Duties: Analyze wafer test data; identify defect sources; optimize manufacturing processes to improve yield; collaborate with fabrication teams for root cause analysis. Skills: Statistical analysis, yield enhancement methods, defect characterization, strong analytical and problem-solving abilities.
Duties: Design and develop semiconductor packages; ensure thermal and mechanical integrity; perform package simulations; optimize package reliability and cost. Skills: Thermal/mechanical simulations, packaging materials knowledge, CAD software, excellent analytical and organizational skills.
Duties: Develop test plans and programs for semiconductor products; conduct device characterization; analyze test data; maintain and calibrate test equipment. Skills: Automated test equipment (ATE) familiarity, scripting/programming, data analysis, methodical troubleshooting approach.
Duties: Ensure semiconductor devices meet quality standards; conduct reliability testing; maintain quality documentation; lead failure analyses and corrective actions. Skills: Quality control practices, reliability testing methods, statistical process control (SPC), excellent communication, detail-oriented mindset.
Duties: Manage teams of engineers; coordinate engineering projects; monitor schedules, budgets, and performance metrics; interface with stakeholders. Skills: Leadership, semiconductor industry knowledge, strong communication, project management, strategic decision-making skills.
Duties: Maintain, install, and troubleshoot semiconductor manufacturing equipment; optimize tool performance; coordinate preventative maintenance activities. Skills: Equipment maintenance expertise, mechanical/electrical troubleshooting, semiconductor processing familiarity, attention to detail.
Duties: Operate and maintain metrology equipment; develop and validate measurement techniques; analyze wafer inspection data; support process characterization. Skills: Measurement techniques, equipment proficiency (AFM, SEM, profilometers), statistical analysis, attention to detail.
Duties: Perform reliability testing and assessments; analyze product lifetime; investigate failures; develop and implement reliability improvement plans. Skills: Reliability engineering methods, statistical modeling, accelerated life testing, strong analytical skills.
These descriptions provide a clear snapshot of the responsibilities and skills required for common roles in semiconductor engineering, helping professionals and employers match expertise with suitable job positions.