Why is silicon wafers preferred over Germanium wafers?
Germanium was in the first transistors. These transistors were meant to replace the vaccum tubes found in World War Two era Radar. The military wanted smaller, lighter and more powerful radar to bomb Germany.
But the ware ended and the military's, spare-no-cost, attitude became more frugal.
With the research open to the public, commercial entities discovered that Silicon worked very well in consumer items such as portable transistor radios. Thus Silicon, which is more abundant and less expensive than Germanium became the standard material and is still being used today and for the foreseable future.
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The current trend is to use silicon instead of germanium, but what could be the reason? As we all know, silicon and germ are semiconductors and are among the most common materials in the world.
Germanium (Ge) was one of the first materials used in semiconductor devices before silicon became dominant. While it's not as widely used today, it still has some compelling properties that make it relevant in niche applications. Here's a breakdown of the pros and cons of germanium semiconductors, along with the reasoning behind each point:
High Carrier Mobility
Why: Germanium has higher electron and hole mobility compared to silicon. This means charge carriers can move faster through the material.
Benefit: Enables faster switching speeds in transistors, which is great for high-frequency and analog applications.
Low Band Gap (0.66 eV)
Why: Germanium’s small band gap makes it easier to excite electrons into the conduction band.
Benefit: More sensitive to infrared light, which is useful for photodetectors and IR sensors.
Excellent Compatibility with Silicon
Why: Germanium can be grown on silicon substrates (e.g., in SiGe or Ge-on-Si devices).
Benefit: Can be integrated into existing silicon fabrication infrastructure, especially for CMOS-compatible devices.
Good for Tunnel FETs and Spintronics
Why: The low effective mass of carriers and narrow band gap support tunneling phenomena.
Benefit: Promising for next-gen low-power electronics.
Higher Leakage Currents
Why: The low band gap leads to higher intrinsic carrier concentration, increasing leakage.
Drawback: Worse performance in digital circuits due to power loss and noise.
Thermal Instability
Why: Germanium oxidizes poorly and doesn’t form a stable native oxide like silicon dioxide (SiO₂).
Drawback: Difficult to make reliable insulating layers, which limits use in MOSFET gate dielectrics.
More Expensive and Less Abundant
Why: Germanium is less abundant and more costly to refine compared to silicon.
Drawback: Not cost-effective for large-scale applications like solar panels or mainstream chips.
Lower Breakdown Voltage
Why: Due to its small band gap and higher dielectric constant.
Drawback: Less suited for high-power or high-voltage applications compared to silicon or SiC.
High-speed RF transistors (e.g., SiGe BiCMOS)
Infrared detectors and night vision
Photovoltaics (multi-junction solar cells)
Research in quantum computing and low-power logic
Would you like a comparison between Ge, Si, and GaAs or how Ge fits into future technologies like quantum computing or AI hardware?
Property | Germanium (Ge) | Silicon (Si) | Gallium Arsenide (GaAs) |
---|---|---|---|
Band Gap (eV) | 0.66 | 1.12 | 1.42 |
Electron Mobility (cm²/V·s) | ~3900 | ~1500 | ~8500 |
Hole Mobility (cm²/V·s) | ~1900 | ~450 | ~400 |
Thermal Conductivity | Lower | High | Lower than Si |
Native Oxide Quality | Poor | Excellent (SiO₂) | Poor (Ga₂O₃ is unstable) |
Cost | High | Low | High |
Breakdown Voltage | Low | High | Medium |
Optoelectronic Use | Good for IR | Poor (indirect band gap) | Excellent for LEDs, lasers |
Common Applications | IR detectors, SiGe HBTs | Microprocessors, solar | High-speed RF, LEDs, lasers |
Germanium: High mobility, low band gap — great for speed and photodetection, but not thermally stable or cost-efficient for general use.
Silicon: Balanced performance, cheap, mature infrastructure — king of digital and power electronics.
Gallium Arsenide: Great for optoelectronics and RF, but brittle, expensive, and hard to fabricate at scale.
Why it's useful: Germanium has high-quality epitaxy and supports quantum dot formation with long spin coherence times (especially Ge/SiGe systems).
Example: Quantum dots in Ge allow for electrically-controlled spin qubits — a hot research area.
Why it's useful: High mobility supports ultra-fast transistor switching; its integration into SiGe platforms could support analog computation or specialized accelerators.
Challenge: Needs better thermal and dielectric solutions for scalability.
Why it's useful: Ge’s low band gap and light effective mass make it excellent for tunneling-based low-power transistors.
Benefit: Could drastically reduce leakage current and power consumption in future AI edge devices.
Silicon crystals have fewer free electrons than germanium crystals at room temperature, which is why silicon crystals are used for semiconductor devices.
In general, the ICBO of germanium is 10-100 times greater than that of silicon, but the variation of ICBo at any temperature is lower for silicon than for germanium. This means that silicon will have a higher ICBI (Inter - Cell Boundary Boiling Point), but a rough rule of thumb - of - thumb with germanium bebe says that the ICBO doubles at the same temperature.
Silicon can work up to 150 degrees Celsius, and therefore excess heat does not damage its components so easily. The maximum normal working temperature for g-germanium is 70 degrees Celsius and the structure of germanium is destroyed at about 100 degrees Celsius.
The PIV value of a silicon diode is almost 1000 V, while it is higher than that of g-germanium diodes. The Piv values for germanium diodes are closer to 400 V and for silicon to about 500 - 600 V.
The disadvantage of silicon compared to germanium is that the preload of the silicon diodes is higher than that of the germanium diodes. This means that high preload is required for high-performance applications such as solar cells, photovoltaics and energy-saving computers.
Silicon crystals contain fewer free electrons than germanium crystals at room temperature, and this is why the modern trend towards silicon semiconductors is going. The disadvantages of silicon have been eclipsed by the other advantages over silicon mentioned above. So why is silicon g - germanium preferred and why are silicon and g germanium both preferred?
The variation of the collector cross-section temperature is lower in silicon than in germanium. This means that silicon has a much smaller collector and thus a higher power output.
The structure of germanium crystals is destroyed at high temperatures, but silicon crystals are not easily damaged by excess heat. The peak voltage values of silicon diodes are greater than those of germanium diodes. Silicon is also cheaper due to the greater abundance of the element and its lower electricity consumption.
There is a lot of sand in nature, and sand is one of the most abundant elements in the earth's crust and a good source of energy.
The first transistors were made with germanium (Ge) and the potential barrier of silicon is greater than that of g germanium. After considering all the advantages listed above, we can conclude that silicon was the best element for semiconductor devices and applications. But what disadvantages does silicon have compared to germ and what advantages does it have compared to silicon?
A chart summarizing the key properties and future tech applications of Germanium, Silicon, and Gallium Arsenide for quick comparison, followed by a deep dive into SiGe BiCMOS and Ge-based quantum dots.
Property / Use Case | Germanium (Ge) | Silicon (Si) | Gallium Arsenide (GaAs) |
---|---|---|---|
Band Gap (eV) | 0.66 (direct/indirect) | 1.12 (indirect) | 1.42 (direct) |
Electron Mobility | ~3900 cm²/V·s | ~1500 cm²/V·s | ~8500 cm²/V·s |
Hole Mobility | ~1900 cm²/V·s | ~450 cm²/V·s | ~400 cm²/V·s |
Thermal Conductivity | Low | High | Moderate |
Native Oxide Stability | Poor (GeO₂ is water-soluble) | Excellent (SiO₂ is robust) | Poor (Ga₂O₃ not ideal) |
Infrared Sensitivity | Excellent | Poor | Moderate |
Photonic Devices | Good (IR detectors, some lasers) | Poor (indirect gap) | Excellent (LEDs, lasers, photodiodes) |
Quantum Dot Compatibility | Excellent | Moderate | Rare |
CMOS Integration | Compatible via SiGe/Ge-on-Si | Native | Incompatible |
Cost & Scalability | Expensive | Very Cheap | Expensive |
Future Roles | Quantum computing, TFETs | Mass CMOS, power devices, AI cores | RF, optoelectronics, high-speed logic |
SiGe (Silicon-Germanium alloy) allows for bandgap engineering and strain tuning in transistors.
The heterojunction bipolar transistors (HBTs) created using SiGe offer:
Higher speed
Lower noise
Lower power consumption
Better high-frequency performance compared to standard CMOS
5G wireless, radar, automotive LIDAR, high-speed ADCs
IBM, GlobalFoundries, and Intel have all developed SiGe BiCMOS nodes for mixed-signal applications.
Quantum dots made from strained Ge or Ge/Si core-shell structures can host electron or hole spin qubits.
Ge has:
High mobility for fast gate control
Long spin coherence times (important for qubit stability)
CMOS-compatible fabrication via Ge/SiGe heterostructures
QuTech (Netherlands), TU Delft, and IBM Research are actively exploring Ge qubits.
Ge-based platforms can potentially scale better than GaAs quantum dots, which suffer from hyperfine noise due to nuclear spins.