We are developing MEMS pressure sensors and require 100 mm silicon wafers with a 1 µm thermal oxide layer, backside polishing, and precision dicing into individual dies. Please provide pricing, lead time, and recommendations for additional wafer processing services.
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UniversityWafer offers a complete range of wafer processing services for universities, research laboratories, startups, and semiconductor manufacturers. From prototype development to production support, our engineering team can process your wafers or supply custom substrates ready for your next fabrication step.
A semiconductor researcher recently requested:
Custom Wafer Services Available
- Thermal oxide growth (wet and dry)
- LPCVD and PECVD silicon nitride deposition
- Metal and thin-film deposition
- Precision wafer dicing
- Wafer grinding and thinning
- Single-side and double-side polishing
- Wafer bonding and custom substrate preparation
- Prototype and production quantities
Our processing services are available for silicon, SOI, silicon carbide, GaAs, GaN on sapphire, sapphire, glass, quartz, and many other research-grade materials.
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Complete Wafer Processing Services
UniversityWafer provides comprehensive wafer services for universities, research laboratories, semiconductor manufacturers, and technology companies worldwide. Whether you require a single prototype wafer or production quantities, our engineering team can deliver custom substrate preparation and processing to meet your project requirements.
Our capabilities include wafer fabrication support, thin-film deposition, oxidation, dicing, polishing, grinding, wafer bonding, and other specialized services designed for MEMS, photonics, power electronics, sensors, quantum devices, and advanced semiconductor research.
Our Wafer Services
| Service | Description | Typical Applications |
|---|---|---|
| Thermal Oxidation | High-quality dry and wet oxide growth. | MEMS, MOS devices, dielectric isolation. |
| Silicon Nitride Deposition | LPCVD and PECVD nitride coatings. | Passivation, MEMS, photonics. |
| Wafer Dicing | Precision singulation of wafers into dies or custom shapes. | Prototype devices and production. |
| Wafer Grinding & Thinning | Reduce wafer thickness while maintaining flatness. | Power devices, MEMS, packaging. |
| Wafer Polishing | Single-side and double-side polishing. | Optical devices and precision substrates. |
| Metal & Thin-Film Deposition | Custom metal coatings and deposited films. | Microelectronics and sensors. |
| Wafer Bonding | Direct and specialty bonding processes. | SOI, MEMS, microfluidics. |
| Wafer Reclaim | Restore used wafers for additional processing. | Cost reduction and equipment testing. |
Supported Substrate Materials
Our wafer processing services are available for a wide range of semiconductor and optical materials, including silicon, SOI, silicon carbide (SiC), gallium arsenide (GaAs), GaN on sapphire, sapphire, quartz, glass, and many other specialty substrates.
Industries We Serve
Our customers include organizations developing next-generation semiconductor technologies for:
- MEMS fabrication
- Silicon photonics
- Power electronics
- RF and microwave devices
- Optoelectronics
- Quantum computing
- Biomedical sensors
- Microfluidics
- Automotive electronics
- Aerospace and defense
Custom Processing Solutions
Whether you need thermal oxide growth, deposited thin films, precision dicing, wafer thinning, polishing, or complete custom substrate preparation, UniversityWafer works directly with researchers and manufacturers to deliver high-quality wafers with short lead times. From prototype development to production-scale manufacturing, our wafer services are tailored to meet your exact specifications.